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After GlobalFoundries abandoned the 7nm and 5nm advanced process development, AMD turned to TSMC. This time it was a big tree, and the next step was from the desktop.serverThen to the notebook, from the processor to the graphics card, all are TSMC 7nm.
After 7nm, TSMC also has 7nm+ EUV, 6nm, 5nm, which allows AMD to choose freely. The next generation architecture on the AMD roadmap, Zen 3, has been marked with 7nm+ technology, which has been a reverie.
TSMC's 7nm process has two generations. It is the first generation (N7) using traditional DUV lithography. The second generation (N7+) will be EUV EUV lithography for the first time. It has already started trial production and will be energy production next year. Increase transistor density by 20% and increase energy efficiency by 10%.
However, we have been unable to determine the 7nm+ used in the AMD Zen 3 architecture, which refers to the process of updating more than 7nm, or the upgraded version of the second generation 7nm in TSMC, but no matter which one, the combination of the new architecture will bring great improvement.
Even more exciting is the 5nm process. TSMC has started trial production and will be mass-produced by the end of 2020. If the Zen 4 architecture can be used, I am afraid Intel does not want to turn over.
According to TSMC, 5nm can increase transistor density by up to 80% compared to 7nm, overall performance is increased by 15%, and core area is reduced by 45%.
Although this is the data obtained on the core of the ARM A72, AMD Zen should not be so much, but if the Zen 4, 5nm double swords are combined, I can't imagine how beautiful the results will be.
Of course, there is also a 6nm process option. In the first quarter of next year, the trial production will increase by 18% compared to the 7nm transistor density, and the platform is fully compatible with 7nm.