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The 16-core 32 threads and 12-core 24 threads of the Ruilong 3000 have also been exposed. AMD is preparing for the desktop this time.The serverAnd there's a "nuclear war" with Intel in the data center market, which currently has only 28 cores and 56 threads on its Xeon processor.
How does AMD do this? In the case of the gradual end of Moore's Law, the technical difficulty and cost of manufacturing super multi-core processors are very high. Intel 14nm technology can only achieve 28 cores because of various technical constraints. AMD can achieve 64 cores 128 threads at once, and the single slot performance and throughput double. This advantage is very competitive in the data center market.
AMD CTO Mark Papermaster talked about this in an interview on AMD's own video program. He believes that AMD has often encountered some industry obstacles in the past 50 years that seem insurmountable, but AMD engineers can always find solutions in the end.
Papermaster also believes that Moore's Law is failing, that people in the semiconductor industry are facing the same physical limits, that lithography is becoming more and more expensive in the process, and that it can no longer bring performance gains, so AMD uses innovative layouts to improve processor performance.
Papermaster's innovative design is that AMD designs multi-module chips through Infinity Fabric high-speed bus technology, which is called chipsets in the industry. Specifically to the Roman processor, that is, the separation of CPU and IO core, CPU part has 8 8 core modules, a total of 64 cores, IO core is manufactured by 14nm process, integrated with DDR memory controller and other chips.
For ordinary people, this design of AMD is usually considered to be "glue multi-core", but now the glue multi-core is different from the glue multi-core that appeared when the dual-core processor just came out more than 10 years ago. Chipsets is a popular design method in these two years. It combines different architectures and different technology cores according to the needs to solve the performance and manufacturing difficulties. The problem.
This design idea is not only AMD in use, Intel and NVIDIA are also studying how to package high-performance CPU/GPU through several small chips, but AMD has been applied first, and in the future, more and more chips will be designed.