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On July 7th, we will see the Ruilong 3000 processor unblocking, but from the perspective of R&D, the 7nm first-generation Zen2 architecture has completed its mission, according toAMDThe roadmap, in 2020 they will launch the Zen 3 architecture processor, the process will be upgraded to 7nm+, which is the 7nm improved version of the EUV lithography process.
In terms of process, TSMC said that the 7nm+ process can achieve a 20% increase in transistor density and a 10% reduction in power consumption under the same load. In terms of architecture, according to AMD CTO Mark Papermaster at the end of last year, Zen 3's design goal is energy efficiency first, based on which to get the best IPC (instruction per clock cycle) increase.
The 7nm+ Zen 3 architecture desktop processor code is unknown, butserverThe new EPYC product identification code is Milan Milan, the third generation after Naples and Rome. At present, we are not sure what the features of the 7nm + Zen 3 processor are, but the architecture design of the desktop 8-16 core and the server with up to 64 cores should not change.
In addition, the new technology support for 7nm + Zen 3 processor will not change much, because AMD promises that the desktop AM4 and server version of the SP3 slot will continue to be compatible in 2020, which means that it is impossible to add DDR5 memory. .
In a recent interview, Forrest Norrod, senior vice president of AMD, general manager of data center and embedded solutions business unit, also expressed his position. One or two generations remain compatible, and the next DDR5 memory era will be different designs. The new interface, the Genoa of the Zen 4 architecture, should be 2021.