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Academician of Chinese Academy of Sciences: 15-20 years gap between Chinese lithography technology and foreign countries

via:快科技     time:2019/9/17 15:36:23     readed:108

At the China Integrated Circuit Design Conference in 2019, Liu Ming, academician of the Institute of Microelectronics of the Chinese Academy of Sciences, also talked about some technical foundations of domestic integrated circuits, especially photolithography, pointing out the progress and shortcomings of photolithography technology.

According to Academician Liu Ming,Our country has made some progress in EUV light source, multi-layer film, mask, photoresist and ultra-smooth polishing technology, but overall, the gap between domestic and foreign lithography technology is still 15 to 20 years, which is the biggest gap in the whole integrated circuit.

Previously, we reported that the EUV lithography machine of ASML company in the Netherlands can be manufactured at 7Nm and below, but the domestic lithography machine can only achieve 90nm process level, most of which are used in low-end production line or panel production line. The process of 28nm and below still needs imported ASML lithography machine to solve.

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