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Material cost exposure of the iPhone 11 Pro Max: 27.5% of the price!

via:博客园     time:2019/9/28 22:31:25     readed:131

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After iFixit dismantled Apple's 11 Pro Max, another foreign analyst, Techinsights, recently dismantled Apple's 11 Pro Max. The main components are analyzed and the overall BOM cost is analyzed.

According to Techinsights, the total BOM cost of the iPhone 11 Pro Max (512GB version is $490.5, or about 3493 yuan, or 27.5 percent of the 12699 yuan it costs.

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As you can see, the cost of the rear three cameras of the iPhone 11 Pro Max is the highest, reaching about 15% of the total cost, which is $73.5. Next came the display and touch screen ($66.5) and the A13 processor ($64).

Compared with the previous iPhone Xs Max (256GB version, the cost of the BOM was about $453, compared with $57.5 for the iPhone 11 Pro Max (512GB version. The cost of the iPhone Xs Max was the highest, at $90.5, followed by the A12 RF / baseband ($72), the flash memory chip ($64.5) and the camera ($44). The cost of the screen was $90.5, followed by the A12 RF / baseband ($72), the flash memory chip ($64.5) and the camera cost of just $44.

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BOM Cost of the iPhone Xs Max (256GB Version)

In other words, the new iPhone 11 Pro Max has seen a sharp drop in screen and storage costs, but has risen sharply in terms of cameras and processor baseband costs. In particular, the cost of cameras increased significantly by $29.5.

Apple A13 Processor

The Apple A13 processor, named APL1W85.A13 processor and Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM, which Techinsights disassembled from the iPhone 11 Pro Max, is packaged together through PoP and has the same 4GB DRAM capacity as the previous iPhone Xs Max last year.

It is worth mentioning that the previous iFixit demolition of the iPhone 11 Pro Max is used, SK Hailishi H9HKNNCRMMVDR-NEH LPDDR4X memory chip.

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The size of the A13 processor (die seal edge) is 10.67mm x 9.23mm = 98.48 mm

Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM has four identical 1y nm bare chips.

base band

As expected, Intel provided baseband chips for the iPhone 11, numbered # Base PMB9960, maybe XMM7660 modem. According to Intel's previously published data, XMM7660 is based on 14nm technology, which is the sixth generation LTE modem for 3GPP Release 14. It supports up to 1.6 Gbps in downlink (Cat.19) and 150 Mbps in upstream.

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In contrast, the previous iPhone Xs Max used Intel PMB9955 XMM7560 modem, which supports up to 1 Gbps in downlink (Cat.16) and 225 Mbps in upstream link (Cat.15).

This is probably the last time we've seen Intel's mobile chipset on the iPhone since Intel officially withdrew from its smartphone baseband chip business. Because Apple settled with Qualcomm early this year and reached a new patent licensing agreement. In addition, in July, Apple reached an agreement with Intel to buy Intel's baseband chip business for $1 billion. So next year's new iPhone will be Qualcomm's 5G baseband chip, if not Apple's own 5G baseband chip.

Radio frequency related device

In terms of radio frequency devices, the previous iFixit demolition showed that the iPhone 11 Pro Max adopted:

Avago 8100 medium / High Band PAMiD Module

Skyworks 78221-17 Low Band PAMiD Module

Intel 5765 P10 A15 08B13 H1925 transceive

Skyworks 78223-17 Power Amplifier

Qorvo 81013 packet tracking module

Skyworks 13797-19 DRx module

The Techinsights disassembled iPhone 11 Pro Max internal RF-related devices are exactly the same.

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Among them, Intel PMB5765 is an RF transceiver that can be used in conjunction with Intel modem.

Power Management IC

In terms of power management IC, the iPhone 11 Pro Max has Intel 6840 P10 409 H1924 baseband power management IC matched with the baseband chip; the main PMIC 343S00355 (APL1092) designed by Apple for A13 Bionic; Apple 338S00510, Apple 338S00510; Texas Instrument TPS61280 battery DC/DC converter; and half-way. Conductor STB601; Texas Instrument SN2611A0 battery charger, Samsung S2DOS23 display power management, etc.

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Intel 6840 P10 409 H1924 Baseband Power Management IC

UWB (U1) chip

Particularly noteworthy is the addition of a USI module to the iPhone 11 series, which probably contains an Apple U1 chip.

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Apple said its newly designed U1 chip uses ultra-broadband technology to achieve spatial awareness, allowing the iPhone 11 Pro to pinpoint other Apple devices that also have U1. This is like adding another kind of perceptual ability to iPhone, which will bring many wonderful new features. With the U1 chip and iOS 13, simply point your iPhone to someone else's iPhone, system to prioritize the other person's iPhone, system, allowing you to share files more quickly.

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It can be understood that the U1 chip is similar to the W1 chip used by Apple on AirPods wireless headphones and the H1 chip, which provides spatial sensing and more accurate positioning.

Apple said the first application to use the new chip was Apple's IrDrop application. With the iOS 13.1 update due to be launched on September 30, AirDrop will be better off with direction-aware recommendations. You can point the iPhone at someone else, and AirDrop will give priority to the device so that you can share files faster.

Apple also said it would launch more advanced apps based on the U1 chip in the coming months.

Memory chip

Techinsights dismantled 512GB version of the iPhone 11 Pro Max using Toshiba (Toshiba) 512GB NAND flash module.

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Wi-Fi / BT module

The Wi-Fi/Bluetooth module of the iPhone 11 Pro Max is Murata 339S00647, and Techinsights speculates that it may be equipped with Broadcom Wi-Fi 6/BT 5.0 wireless combination IC BCM4375.

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NFC module

Enzipu won another order for Apple's iPhone with its new SN200 NFC&SE module.

Wireless Charging Chip

The wireless charging chip uses Italian semiconductor (STMicroelectronics) STPMB0 933ANH HQHQ96 170721G. And that may also mean that Bolton has lost its order for Apple's iPhone wireless charging chip.

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Apple's 18W Charger and Its Four Chips

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IPhone11Pro Max comes with Apple 172018W USB-C power charger. The rated voltage of the equipment is 5V/3A or 9V ≤ 2A.

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camera

For the first time, the iPhone 11 Pro Max is equipped with a rear triple lens, which consists of a 1200 million pixel wide angle (f ≤ 1.8) lens + a 1200 000 pixel long focal (f ≤ 2.2) lens + a 1200 million pixel ultra wide angle (f ≤ 2.0) lens, which supports four times optical zoom.

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The front side of the iPhone 11 Pro Max also incorporates a Face ID based on 3D structured light and a 12-megapixel self-timer lens.

Sony is still a supplier of four iPhone11 Pro Max visual cameras, Techinsights said. ST Microelectronics, on the other hand, has been the supplier of infrared camera chips in the iPhone front-end structured optical module for three years in a row.

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Details of the iPhone 11, the iPhone 11 Pro Max camera

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12 MP rear wide angle camera image sensor naked photo (removed filter)

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12 MP Backward Ultra Wide Angle Camera Image Sensor Bare Film Photo (Filter Removed)

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12 MP rear long focal machine image sensor transmits naked photo (removed filter)

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12 MP Front Camera Image Sensor Bare Photo (Filter Removed)

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1.4 MP front infrared camera image sensor naked photo

Audio IC

Apple / Cirrus Logic 338S00509 audio codecs and three Apple 338S00411 audio amplifiers.

Other

The iPhone 11 Pro Max is also based on the ST Microelectronics ST33G1M2 MCU, Enzipu CBTL1612A1 display port demultiplexer, the sipras CYPD2104 USB Type-C port controller.

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