Samsung emphasizes some high requirements of vehicle chips, such as the need to meet the AEC-Q100 reliability standards, to withstand the temperature range from - 40 ~105 ~C, supply chain management system must also meet the IATF 169169 certification, in addition to manufacturing tools and equipment itself must meet different ISO 26262 (ASIL) safety specifications.
Samsung's current technology for on-board chips is still 28nm (28FDS) and 14nm, so upgrading to 8nm will be a huge leap forward.
The latest technology for the automotive environment of TSMC is 16nm (16FFC), which will be upgraded based on the first generation 7Nm (N7), and is expected to be put into commercial use by 2020.
In fact, Xinsi Technologies has developed a car-grade IP for TSMC's 7nm, which is easy to upgrade in the future.
Oh, and the technology of cell core (GlobalFoundries), for automobile is 22 FDX and 12 LP, which is not backward at present, but because core has given up updating process research and development, how to face competition in the future will be a headache.