On December 18, Samsung officially announced thatBaidu's first AI chip Kunlun has been developed and will be contracted by Samsungat the earliest mass production will be achieved early next year. Specifically, Kunlun chip is based on Baidu's own developed, cloud-oriented, edge-oriented and artificial intelligence neural processor architecture XPU and Samsung's 14nm process technology.
In addition, the chip also uses I-Cube TM packaging solution; the logic chip and high-bandwidth memory are connected to the plug-in through I-Cube TM technology, and Samsung's differentiated solution can be used to provide higher density / bandwidth at the minimum size. Compared with previous technologies, I-Cube TM packaging solutions can maximize product performance, such as power supply, signal integrity by more than 50%.
In terms of computing power, Kunlun chip provides 512 GBps memory bandwidth and achieves 260 TOPS processing power at 150 watts, and it supports Ernie, reasoning speed of pre-training model for natural language processing three times faster than that of traditional GPU/FPGA acceleration model.
With this chip's computing power and energy efficiency, Baidu can support a variety of functions, including mass artificial intelligence computing, such as search sorting, speech recognition, image processing, natural language processing, autopilot and Paddle Paddle.
In general, this is the first cooperation between Baidu and Samsung in terms of labor. Through this cooperation, Baidu will be able to provide AI platform with maximum AI performance, while Samsung can expand the chip manufacturing business to high-performance computing chips(HPC)dedicated to cloud computing and edge computing design.
Ouyang Jian, Baidu architect, said:
Being happy to lead the HPC industry with Samsung, the Kunlun chip is a challenging project that requires not only high reliability and performance, but also the most advanced technology in the semiconductor industry. Thanks to Samsung's advanced technology and casting services, let's have an excellent experience for users.
Ryan lee, president of samsung's electronics contract marketing department, said the baidu kunlun chip was an important milestone for samsung's foundation, and that samsung would offer a full range of contract manufacturing solutions, from design support to cutting-edge manufacturing technologies such as 5lpe,4lpe and 2.5d packages.