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What is the status quo of domestic memory chips?

via:雷锋网     time:2020/7/2 21:59:24     readed:112

"There are three key points to look forward to the market trend in the second half of 2020," said Sanjay Mehrotra, Meguiar's chief executive, when it released its third quarter results on Monday, June 29. First of all, we hope that the data center has a bright future; secondly, we hope that the sales of smart phones and consumer terminal devices will continue to improve, so as to accelerate the inventory consumption in the whole supply chain; thirdly, we hope that the new game console will promote more DRAM and NAND demand. "

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What is the current situation of semiconductor memory chip in China? How far is the gap with memory chip giants like Micron Technologies?

Domestic chip supply and demand gap

China has been trying to reduce its dependence on foreign semiconductor manufacturing companies. According to the report "Semiconductor and equipment market in mainland China: analysis and manufacturing trend ", China's imports of 445.13 billion ICs in 2019, an increase of 6.6% over the same period last year, and imports of 305.55 billion US dollars, a decrease of 2.1% from the same period last year. Integrated circuit exports totaled 218.7 billion yuan, up 0.7 percent from the same period last year, while exports amounted to $101.58 billion, up 20 percent from the same period last year.

At present, there is a large gap between the demand for semiconductor equipment needed by Chinese OEM manufacturers to produce electronic equipment and the supply of internal manufacturing in China. Although the number of self-made chips in China has increased year by year, the demand is also increasing year by year. The supply is expected to reach 400 billion by 2022, the demand is 750 million, and the gap between supply and demand is 350 million.

Despite the impact of trade restrictions in 2019, the growth rate of China's semiconductor import volume will not decrease. Under the new epidemic situation in 2020, the growth rate of China's semiconductor import volume is even faster.

In the past nine quarters, two Chinese memory chip companies, ymic, which makes 3D NAND, and cxmt, which makes DRAM, have purchased $3 billion of production equipment in the past nine quarters.

Development status of memory chips in China

In China's memory chip market, many companies are stepping up the deployment of new fabs, whether in terms of capital or technology, are full of power.

Changxin storage

The first wafer factory of Changxin storage has announced the plan of 19nm technology, with a total production capacity of 120000 pieces / month, and the production capacity has been increased from 20000 pieces to 30000 pieces per month, which has been delayed for more than a year and will start production at the end of 2019. Changxin plans to add two more wafer plants near its Fab 1.

In addition, Changxin storage has also set the next goal, and is expected to promote the development of lpddr5 DRAM products in the next 2-3 years, and upgrade the process to below 17nm.

Yangtze River storage

Changjiang storage's first plant in Wuhan was a single story building with a monthly capacity of 120000 wafers. Using the existing 12 inch factory of its wholly-owned subsidiary XMC, Changjiang storage successfully designed and manufactured the first 32 layer NAND flash memory chip in 2017.

On September 2, 2019, Changjiang storage announced that 64 layer NAND flash memory chips had been put into production, and 256 GB TLC 3D NAND flash memory based on xtacking architecture had been put into mass production.

It is reported that the parent company of Changjiang Storage Tsinghua Ziguang Group plans to build a second wafer factory next to the first wafer factory in Wuhan, originally scheduled to start by the end of 2020, but the progress has been accelerated. Although tsinghua ziguang group did not disclose the annual production capacity and the amount of investment, the company is considering a total of 800 billion yuan investment in its DRAM business within a decade.

Chongqing Qinghua Ziguang

Tsinghua Ziguang group announced on August 27 that it has signed an agreement with Chongqing municipal government to establish a R & D center and DRAM wafer plant. The fab is expected to be completed in 2022, producing 100000 wafers a month. The Fab was originally planned to start construction last year, but was delayed due to trade restrictions and the new crown epidemic.

Zhaoyi innovation

Zhaoyi Innovation announced in April 2020 that it plans to raise 4.32 billion yuan through non-public issuance of new shares to fund its entry into the DRAM storage market. Besides their own DRAM plan, Zhaoyi Innovation will also invest in Changxin storage.

Changjiang storage 128 layer NAND will be put into production, only two quarters behind Meguiar

In 2019, Changxin storage's DRAM will lag behind the leading DRAM manufacturers by at least two generations. By 2021, Changxin storage will lag behind Meiguang, Samsung and SK Hynix.

In 2018, Changjiang storage's 32 layer NAND lags three generations behind the world's leading NAND manufacturers. However, with the acceleration of the Yangtze River storage roadmap, it announced the launch of 128 layer NAND in 2020, which is planned to be put into production in the fourth quarter of 2020. This means that the new NAND of Changjiang storage will be only two quarters behind Meguiar and SK Hynix, and be comparable with kioxia / Western Digital (WDC) 112 layer NAND.

It is worth mentioning that the construction plan of Changjiang storage's second NAND wafer plant will be advanced. The NAND device of Yangtze River storage uses DUV immersion lithography technology. Even EUV without ASML can produce 3D NAND chip.

Therefore, in the process of catching up with Meguiar, we don't have too many obstacles on the devices. We are confident to win the battle of memory chip pursuit.

Summary

Although China's local memory chip manufacturers are small in number, small in scale, and lag behind the leading enterprises in product technology, Changjiang storage and Changxin storage are developing rapidly. They have successively built new wafer factories and developed new products. This makes us have reason to believe that DRAM and NAND memory chips in China will be able to stand out from the tight encirclement one day, which is similar to that of storage chips such as micron technology Companies compete.

From August 7 to August 9, 2020, ccf-gair 2020) will be solemnly held in Shenzhen. This year's theme is new opportunities for AI new infrastructure industry. There are three special sessions for new infrastructure academic, namely, AI frontier, robot frontier and federal learning, and 11 special sessions for new infrastructure industry, such as AI chip, intelligent driving and aiot. AI chip experts and key enterprise technology VP will jointly discuss how to seize the excellent opportunities brought by the new infrastructure to AI chips with innovative instruction set, architecture and business model.

From August 7 to August 9, 2020, ccf-gair 2020) will be solemnly held in Shenzhen. This year's theme is new opportunities for AI new infrastructure industry. There are three special sessions for new infrastructure academic, namely, AI frontier, robot frontier and federal learning, and 11 special sessions for new infrastructure industry, such as AI chip, intelligent driving and aiot. AI chip experts and key enterprise technology VP will jointly discuss how to seize the excellent opportunities brought by the new infrastructure to AI chips with innovative instruction set, architecture and business model.

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