At the process and packaging technology conference this morning, Intel announced the latest process roadmap, and the naming method has been comprehensively changed. For example, the 10nm ESF process has been renamed Intel 7, and the 7Nm process has been renamed Intel 4. In terms of publicity, it is equivalent to TSMC and Samsung this time.
In addition to the new roadmap, Intel's IFS OEM business has also gained an important customer. Qualcomm will use Intel's OEM service for the first time. Since Intel reorganized its OEM business, it is currently the largest and most important customer.
However, we can see that Qualcomm chips produced by Intel are still far away,Because Qualcomm uses Intel's future Intel 20 process, it will not be mass produced until 2024 at least, and it will have to wait three years if there is no ticket skipping.
The reason for waiting so long is that Intel's 20A process has changed too much. It has abandoned the FinFET process and turned to GAA transistors. Intel has developed two revolutionary technologies,They are ribbonfet and powervia.
Powervia is Intel's unique and the industry's first back power transmission network, which optimizes signal transmission by eliminating the power supply and wiring requirements on the front of the wafer.
Ribbonfet is Intel's implementation of GAA transistors. It will become the first new transistor architecture since the company first launched FinFET in 2011. This technology speeds up the switching speed of the transistor and realizes the same driving current as the multi fin structure, but takes up less space.